A20 Chips in iPhone 18 Models Again Rumored to Feature New Design

Apple's A20 spot successful the iPhone 18 volition beryllium packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple proviso concatenation expert Ming-Chi Kuo. This alteration has been rumored by multiple other sources previously.


Apple would beryllium moving distant from TSMC's InFO (Integrated Fan-Out) packaging it uses currently.

It is unclear if this alteration volition beryllium constricted to higher-end models, similar the iPhone 18 Pro and the alleged "iPhone 18 Fold," oregon if it volition widen to the modular iPhone 18 and iPhone 18 Air. Kuo's probe enactment contiguous mentioned a 2nd fractional of 2026 timeframe, which is erstwhile the iPhone 18 Pro and foldable iPhone are expected to launch. The Information said the lower-end iPhone 18 models will not beryllium released until outpouring 2027.

In immoderate case, astatine slightest immoderate A20 chips would person RAM integrated straight onto the aforesaid wafer arsenic the CPU, GPU, and Neural Engine, alternatively than sitting adjacent to the spot and connected via a silicon interposer. This could lend to faster show for some wide tasks and Apple Intelligence, and longer artillery beingness from improved powerfulness efficiency. A20 chips whitethorn instrumentality up little abstraction successful the iPhone compared to erstwhile chips.

A20 chips are besides expected to beryllium manufactured with TSMC's 2nm process, which would besides lend to faster show and improved powerfulness ratio implicit A18 and A19 chips, which are oregon volition beryllium fabricated with TSMC's 3nm processes.

All successful all, A20 chips successful iPhone 18 models are shaping up to person important underlying changes.
This article, "A20 Chips successful iPhone 18 Models Again Rumored to Feature New Design" archetypal appeared connected MacRumors.com

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